![]() DEVICE FOR DISSIPATING HEAT FROM A MULTIMEDIA CONTROL UNIT
专利摘要:
A heat dissipating device (44) comprises a generally rectangular cooling plate (50); the metal plate (50) comprising on its upper face (74) first fixing means (134, 135) of a first printed circuit board (46) designed to bear at least one heat-generating zone (124) the first printed circuit board (46) on the upper face (74) of the tray (50); the metallic plate (50) comprises on its underside second fastening means of a second printed circuit board (48) provided for supporting at least one heat-generating zone (130) of the second printed circuit board ( 48) on the underside of the tray (50). 公开号:FR3060202A1 申请号:FR1662311 申请日:2016-12-12 公开日:2018-06-15 发明作者:Marcin Hyrlicki;Pawel Brache;Krzysztof Adamczyk;Grzegorz Szostek 申请人:Aptiv Technologies Ltd;Delphi Technologies Inc; IPC主号:
专利说明:
TECHNICAL AREA The invention relates to the field of automotive multimedia electronic control units. More particularly, the invention relates to a heat dissipation device for a multimedia electronic control unit. TECHNOLOGICAL BACKGROUND OF THE INVENTION Electronic multimedia control units on board the automobile generally include a metal case provided with numerous electronic interface connectors. The metal housing generally comprises electronic modules arranged in metal racks arranged parallel next to each other. Each electronic module is generally dedicated to a multimedia function such as compression or decompression of sound, compression or decompression of video films, amplification of sound, reception and processing of signals from a navigation system, reception and demodulation of radio signals, wireless communication interface between the vehicle and portable equipment, telephony interface ... Each metal rack has a metal structure comprising fine fins in order to serve as a heat dissipation device for their respective electronic module. The metal case also generally includes openings to dissipate the heat dissipated by the metal racks. It is also known to facilitate the extraction of hot air from electronic modules using a fan arranged in the metal case and facing openings in the metal case. The metal structure also makes it possible to respond to the constraints of electromagnetic interference between the electronic modules and also to the constraints of radio frequency interference external to the multimedia control unit. The known multimedia control units are therefore bulky, heavy and complex to assemble. Their current structure does not meet the current weight reduction and also volume reduction requirements for current and future vehicles. It is therefore important to offer a new solution to these problems. SUMMARY OF THE INVENTION A heat dissipation device comprises a generally rectangular metal cooling plate, the metal plate comprising on its upper face first means for fixing a first printed circuit card intended to support at least one heat generating zone of the first printed circuit board on the upper side of the board. The metal plate comprises on its lower face second means for fixing a second printed circuit card intended to support at least one heat generating zone of the second printed circuit card on the lower face of the plate. The upper face of the plate may include a first section equipped with a plurality of vertical cooling fins each extending in a longitudinal direction substantially parallel to one side of the plate; the first section comprising a part of the first fixing means so as to allow the support of a heat generating zone of the first printed circuit board on cooling fins. The first section may include a flat cooling zone extending transversely over the top of at least two fins so as to allow the support of a heat generating zone of the first printed circuit board on the flat cooling zone . The first section may include at least one vertical solid cylindrical pad overmolded in a cooling fin so as to allow the support of a heat generating zone of the first printed circuit board on the free end of the solid cylindrical pad. The first section forms a rectangular recess in the upper face of the tray, forming a rectangular protuberance on the underside of the tray. The underside of the first section may include a portion of the second fastening means so as to allow the support of at least one heat generating zone of the second printed circuit board on the underside of the first section. The underside of the first section may include at least one planar cooling surface forming a protuberance on said underside, so as to allow the support of a heat generating zone of the second printed circuit board on the planar surface cooling. The tray may have at least three metal pillars extending vertically downward from the underside of the tray. The lower end of each pillar can be provided with a fixing means designed to be fixed on a case bottom so as to keep the board raised to arrange the second printed circuit board on the underside of the board. A transverse side of the plate can include a fan support capable of receiving a fan making it possible to create a flow of cooling air from the plate in a longitudinal direction. The plate may include deflectors arranged between the fan support and the first section capable of guiding the flow of cooling air. The tray can have an opening between the first section and the fan support, so as to promote air flow on both sides of the tray. The tray may include an electrical connection element comprising two flexible contact ends; the first end being provided for establishing electrical contact by compression between the cooling plate and an electrically conductive element of the first printed circuit board or of the second printed circuit board; the second end being provided to establish an electrical contact by compression between the plate and a metal case enclosing the heat dissipation device; so as to thermally and electromagnetically protect the electrically conductive element. The electrical connection element may comprise an intermediate part by which the connection element is fixed to the plate, the intermediate part being extended on one side by the first flexible end mainly in a direction perpendicular to the plate, and from other side by the second flexible end mainly following a coplanar direction to the plate. The heat dissipation device can be made from a single metal piece. According to the invention, an electronic assembly comprises the heat dissipation device described above, a first generally rectangular printed circuit board comprising a heat generating zone bearing on the upper face of the cooling plate; a second generally rectangular printed circuit card comprising a heat-generating zone bearing on the underside of the cooling plate. The electronic assembly may include a closed metal housing of generally rectangular rectangular shape; the heat dissipation device being fixed in the bottom of the housing. The housing may include a first group of openings arranged on a first lateral face of the housing and facing the cooling plate. The housing can also include a second group of openings arranged on a second lateral face of the housing opposite to the first face and facing the cooling plate so as to allow the circulation of a flow of cooling air from the first group of openings to the second group of openings. A fan can be mounted in the fan support and can be arranged in the housing opposite one of the two opening groups so as to facilitate the circulation of the cooling air flow. The tray may include an electrical connection element. At least one of the printed circuit boards includes a conductive element, the conductive element being in electrical contact by the electrical connection element with the plate and the metal case so as to thermally and electromagnetically protect the conductive element. BRIEF DESCRIPTION OF THE DRAWINGS Other characteristics, objects and advantages of the invention will appear on reading the detailed description which follows, and with reference to the appended drawings, given by way of non-limiting example and in which: Figure 1 and Figure 2 are schematic perspective views of the multimedia control unit according to the invention. FIG. 3 represents an exploded schematic perspective view of the multimedia control unit according to the invention. FIG. 4 represents a schematic perspective view of the upper face of the heat dissipation device of the multimedia control unit according to the invention. FIG. 5 represents a schematic perspective view of the assembly of a first printed circuit card on the upper face of the heat dissipation device of the multimedia control unit according to the invention. FIG. 6 represents a schematic perspective view of the underside of the heat dissipation device of the multimedia control unit according to the invention. Figure 7 shows a schematic perspective view of the assembly of a second printed circuit board on the underside of the heat dissipation device of the multimedia control unit according to the invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS According to Figure 1, Figure 2 and Figure 3, an exemplary embodiment of an electronic multimedia control unit 10 intended to be mounted in a motor vehicle is shown. The multimedia control unit 10 comprises a metal case 12 generally forming a rectangular parallelepiped. The housing 12 of the control unit 10 therefore has six rectangular facades. In order to facilitate the description, and without limitation, an orthogonal coordinate system comprising a longitudinal axis L, a transverse axis T and a vertical axis V is defined. Orientations "bottom", "top", "above", "below", "lower" and "upper" are defined in the vertical direction. "Left", "Right" and "Lateral" orientations are defined in the longitudinal direction. "Front" and "rear" orientations are also defined according to the transverse direction. The housing 12 therefore comprises, in the direction of the longitudinal axis L, a right lateral facade 14 and a left lateral facade 16. The housing also comprises, in the direction of the transverse axis T, a rear facade 18 and a facade before 20. Finally, the casing comprises, in the direction of the vertical axis V, a lower facade 22 and an upper facade 24. The lower facade 22 of the casing is also called the bottom of the casing. The front panel 20 and the rear panel 18 have multiple connectors 26 allowing the multimedia control unit 10 to be electrically connected to other electronic equipment of the vehicle. The rear facade 18 comprises on either side according to longitudinal tax, two fixing lugs 28, 30 for mounting the multimedia control unit 10 in the vehicle, more precisely to mount it on the body of the vehicle serving as electrical ground. of the vehicle. The right side cover 14 and the left side cover 16 respectively have a first group of openings 32 and a second group of openings 34 provided for circulating in the multimedia control unit 10 an air flow. More particularly, the left side facade 16 is provided with openings 34 arranged generally in a circle. The second opening group 34 is provided for removing hot air from the control unit 10. Preferably a fan 36 is arranged in the control unit 10 to improve the air flow and more particularly to promote extracting hot air. The blades of the fan impeller 36 are arranged directly opposite the second opening group 34. The first opening group 32 is provided for bringing fresh air into the control unit 10 for cooling purposes. The upper facade 24, together with the other five facades 14, 16, 18, 20, 22, closes the metal housing 12, allowing the housing 12 to resemble a protective cage against external electromagnetic interference. According to FIG. 3, the electronic multimedia control unit 10 comprises the box 12 and an electronic sub-assembly 38. The housing 12 consists of a first metal part 40 and a second metal part 42. The first metal part 40, made in one piece, brings together the upper facade 24, the front facade 20, the right side facade 14 and the left side facade 16. The second metal part 42, made in one piece, brings together the lower facade 22 and the rear facade 18. The electronic sub-assembly 38 comprises a metal heat dissipation device 44 on which are fixed a first printed circuit card 46 and a second printed circuit card 48. The first printed circuit board 46 is fixed on the top of the heat dissipation device 44. The second printed circuit board 48 is fixed on the bottom of the heat dissipation device 44. The heat dissipation device 44 comprises a metal plate 50 supported by 4 vertical pillars 52, 54, 56, 58 oriented towards the bottom of the housing 22 and each free end 60, 62, 64, 66 of which is provided with a pitch of screw. The metal plate 50 is arranged between the two printed circuit boards 46, 48. For the purpose of assembling the multimedia control unit 10, the housing 12 and the electronic sub-assembly 38 are fixed together by screwing. It will be noted more particularly that the lower facade 22 of the housing has at each of its angles, holes through which the first fixing screws 68 are inserted in the threads of the four pillars 52, 54, 56, 58 thus ensuring the maintaining the electronic sub-assembly 38 in the housing 12. Other fixing screws come to fix the other facades to the electronic sub-assembly 38. More particularly, it will be noted that second fixing screws 70, in particular on the front face 20, come to fix the first metal part 40 of the housing to metal connector bodies of the printed circuit boards 46, 48. Finally, third fixing screws 72 fix the first metal part 40 of the housing to the second metal part 42 of the housing. This assembly, by bringing the metal parts of the electronic sub-assembly 38 into contact with the metal housing 12, not only makes it possible to reach a first level of heat dissipation, and also to reach a first level of protection of the electronic sub-assembly against electromagnetic interference. Other fixing screws allowing assembly of the housing with the electronic sub-assembly 38 are possible. By way of example and without limitation, the rear cover may also include a group of fixing screws making it possible to connect the housing 12 to other metal connector bodies of printed circuit boards. Alternatively, the heat dissipation device 44 may comprise three or more pillars, the objective being to keep the plate 50 raised in relation to the bottom of the housing 22, thus allowing the attachment of the second printed circuit board 48. According to Figure 4, the metal plate 50 is generally horizontal along the plane defined by the longitudinal axis L and the transverse axis T. The plate 50 is arranged on the four vertical pillars 52, 54, 56, 58. The plate 50 is generally rectangular and has a horizontal plan overall overall similar to the lower facade 22 of the housing. The plate 50 has an upper face 74 oriented towards the upper front 24 of the housing and a lower face 76 oriented towards the lower front 22 of the housing. The plate 50 has, on its upper face 74, two vertical walls 78, 80 each extending along its two longitudinal sides. The upper face 74 of the plate also includes a left vertical wall 82 extending along its left side from the front longitudinal side to an end arranged approximately halfway along the left side. A fan support 84 is arranged transversely between the end of the left vertical wall 82 and the rear vertical wall 78. The fan support 84 is arranged in continuity with the left vertical wall 82. The fan support 84 extends from the end of the left vertical wall 82 to the rear vertical wall 78. The fan support 84 is arranged in a vertical plane perpendicular to the longitudinal axis L. The fan support 84 is of generally rectangular shape. The support has two transverse edges 86, 88 and two vertical edges 90, 92. The two vertical edges 90, 92 are, one directly in contact with the end of the left vertical wall 82 and the other directly in contact with the wall rear vertical 78. The two transverse edges 86, 88 are respectively arranged one at a vertical height above the plate 50, the other at a vertical height below the plate 50. Preferably, the two edges 86, 88 transverse are arranged at equal distance above and below the plate 50. The fan support 84 has in its center a circular opening of diameter almost identical to the diameter of the impeller of a fan 36, allowing a fan 36 arranged in the support 84 to ventilate both the upper face of the plate 74 and the lower face of the plate 76. The upper face of the plate 74 has a first horizontal planar section 94 of rectangular shape. The first section 94 is delimited by two longitudinal edges parallel to the rear and front sides of the tray. The two longitudinal edges each respectively form a longitudinal rear vertical wall 96 and a longitudinal front vertical wall 98. The first section 94 is centered symmetrically along the longitudinal axis of symmetry L of the plate. The first section 94 extends longitudinally from the transverse right side of the plate 50 to approximately 4/5 of the length of the plate along the longitudinal axis. The first section 94 also extends transversely, symmetrically on either side of the longitudinal axis of symmetry L of the plate 50 to a total width along the transverse axis T representing 3/5 of the width of the plate . The first section 94 forms a rectangular recess in the upper face of the plate, also forming a rectangular protuberance 100 on the lower face of the plate 76. The first section 94 comprises a plurality of vertical cooling fins 102 directed upwards and each extending along the longitudinal axis L over the entire length of the first section 94. The fins 102 are regularly spaced from one another by inter-fin spaces 104. The plurality of fins 102 is therefore arranged between the longitudinal rear vertical wall 96 and the longitudinal front vertical wall 98 of the first section 94. Each fin is parallel to the longitudinal walls of the first section 94. The walls vertical 96, 98 longitudinal can be likened to cooling fins. The rear vertical wall 96 and the front vertical wall 98 of the first section 94 are connected to the fan support 84 by two additional walls 106, 108. The two additional walls 106, 108 respectively connect the two vertical walls 96, 98 to the two edges 90, 92 of the fan support 84. The two additional walls 106, 108 can be likened to two deflectors making it possible to advantageously orient the air flow through the inter-fin spaces of the first section 94. The space between the two additional walls is a gaping opening 110. The gaping opening between the first section 94 and the fan support 84 also makes it possible to promote the air flow both on the underside of the tray 76 and on the upper face of the tray 74. The upper face of the plate 74 comprises, outside the first section 94 and on each side of the two walls 96, 98 of the first section 94, respectively a second section 112 and a third section 114. The second ίο section 112 and the third section 114 are generally flat rectangular surfaces. The second section 112 is the section directly adjacent to the longitudinal rear vertical wall 96 of the first section 94. The third section 114 is the section directly adjacent to the longitudinal front vertical wall 98. The second section 112 and the third section 114 extend longitudinally on either side of the first section 94, from the right lateral side of the plate 50 to the left lateral side of the plate 50. The second section 112 and the third section 114 also extend transversely respectively from each longitudinal vertical wall of the first section 96, 98 to the rear vertical wall 78 and to the front vertical wall 80 of the plate 50. The second 112 and the third section 114 are slightly raised vertically with respect to the first section 94. According to Figure 4 and Figure 5, the first printed circuit board 46 and the second printed circuit board 48 have both on their top face and on their underside of electronic components 116, 118, 120, 122 connected between them by conductive tracks. Certain components or certain conductive tracks, in particular the conductive tracks of strong currents, can form heat generating zones 124, 126, 128, 130, 132, that is to say zones generating heat during the operation of the module. of the multimedia control unit 10. The upper face of the plate 74 is adapted to receive the first printed circuit card 46. The upper face of the plate 74 is equipped with several fixing pads 134, 135 for the first printed circuit card 46. The fixing pads 134, 135 provided for the first printed circuit board 46 are oriented vertically upwards and allow the first printed circuit board 46 to be held flat, in a horizontal plane. All the fixing pads 134, 135 are of hollow cylindrical shape, the hollow being a thread. The first printed circuit board 46 is therefore designed to be supported by screwing against the plurality of fins 102 of the first section 94. According to the embodiment shown, by way of example and without limitation, the fixing studs 134 are distributed on the upper face 74 of the plate 50. A first fixing stud 134 is arranged at the end of the second section, close to directly from the fan support and in the immediate vicinity of a first angle of the plate. A second 134, a third 134 and a fourth fixing stud 134 are generally arranged vertically aligned with the three vertical fixing pillars of the heat dissipation device 44 arranged at the three other angles of the plate. A fifth fixing stud 135 is arranged vertically in the fin arranged along the longitudinal axis of symmetry of the plate. The fifth stud is generally arranged at 2/3 of the length of said fin. Finally, a sixth fixing stud 135 is arranged adjacent to the rear wall of the first section, on the second section 112, generally 1/3 of the length of the first section. More generally, it will be noted that four fixing pads 134 are generally provided to maintain the first printed circuit board 46 at these four angles. Two other fixing pads 135 are arranged on the cooling fins 102, near the heat generating zones 124, 126, 128 of the first printed circuit board 46 so as to improve the support of these heat generating zones 124, 126, 128 on the cooling fins 102. In order to facilitate the dissipation of heat from the first printed circuit board 46, the upper face of the first section 94 has solid studs 136, the upper free end of which serves as a bearing surface for heat generating zones 124, 126 or hot spots of the first printed circuit board 46 of power in operation. Each solid stud 136 is of full cylindrical shape arranged in the plurality of cooling fins 102. Preferably, the solid studs 136 are overmolded with the plurality of cooling fins 102. Additionally, a planar cooling zone 138, generally rectangular, is arranged transversely on four fins. The flat cooling zone 138 also allows a heat generating zone 128 (FIG. 7) of the first printed circuit board 46 to come to bear on the heat dissipation device 44. The inter-fin spaces 104 under the flat zone of cooling 138 allow the passage of an air flow favoring the heat dissipation of the heat generating zone 128 bearing on the flat cooling zone 138. Preferably, the heat generating zones 128 are located on the underside of the first printed circuit board 46 and are directly in contact by pressing on the flat cooling zone 138 and / or directly in contact by pressing with the surfaces d support of the free end of the solid studs 136. However, it is also possible to cool the heat generating zones 124, 126 of the top face of the first printed circuit board 46 when these are supported indirectly on the flat cooling zone 138 and / or indirectly bearing on the bearing surfaces of the free end of the solid studs 136; that is to say separated from the flat cooling zone 138 and / or the bearing surfaces of the free end of the solid pads 136 by the thickness of the first printed circuit board 46. The upper face of the second section 112 comprises an electrical connection element 140 comprising two flexible contact ends 142, 144. The electrical connection element 140 comprises an intermediate portion 146 by which the connection element is fixed to the plate 50 , the intermediate part being extended on one side by the first flexible end 142 mainly in a direction perpendicular to the plate 50, and on the other side by the second flexible end 144 mainly in a direction coplanar with the plate 50. The intermediate part 146 comprises two circular holes allowing the electrical connection element 140 to be clipped into two fixing lugs of the second section 112. The fixing lugs hold the intermediate part 146 in contact with the upper face of the second section 112 The intermediate part 146 is extended on one side by the first flexible end 142, and on the other side by the second flexible end 144. More specifically, the two pins are arranged on the upper surface of the free end of a cylindrical metal support with a generally rectangular base. The support has the same vertical height as the rear vertical wall 78. The intermediate part 146 comes into direct contact with the surface of the free end of the metal support. The electrical connection element 140 is arranged in the lugs so that the first end 142 extends transversely towards the inside of the heat dissipation device 44 and vertically upwards and in that the second end 144 s 'extends transversely to the outside of the heat dissipation device 44. Alternatively, the intermediate part 146 can be fixed by welding on the plate 50; in this case, the plate 50 does not have pins and the intermediate part does not have holes. In other words, the first end 142 and the second end 144 extend on either side of the rear vertical wall of the plate 78. By way of nonlimiting example, each flexible end comprises three blades curved so as to form a support surface at the free end of the three blades. The three blades of the second end 144 of the electrical connection element 140 are designed to be compressed in abutment between the heat dissipation device 44 and the housing of the control unit. More precisely, each curved end of the three curved blades of the second end 144 is designed to come into contact bearing on the rear face of the housing 18. The three blades of the first end 142 of the electrical connection element 140 are designed to be compressed between the heat dissipation device 44 and a connector of the first printed circuit board 46. More precisely, each curved end of the three blades curved at the first end 142 is intended to come into contact bearing on the metal body 148 with a connector type connector dedicated to high speed communications or also with an antenna connector or radio frequency antenna cable. The electrical connecting element 140 allows the contact, by crushing of its ends, of a metal body connector 148 of the first printed circuit board 46 to the heat dissipation device 44 as well as to the housing 12 of the multimedia control unit 10. It may preferably be a connector dedicated to high-speed communications or also an antenna connector or radiofrequency antenna cable. The contacting by the electrical connecting element 140 of a connector with the heat dissipation device 44 and the housing allows local electrical grounding of said connector. It should be understood that the multimedia control unit 10 is intended to be fixed to the body of the vehicle, the body of the vehicle serving as electrical ground. The heat dissipation device 44 has in this case a role of protection against electromagnetic interference which can disturb the signals passing through said connector and also of limiting the electromagnetic radiation of said connector during the transit of high speed signals or during transmission of radio frequency signals. The rear vertical wall 78 and the front vertical wall 80 of the plate 50 each comprise a circular opening 150, 152. Each circular opening 150, 152 is arranged at the upper surface of the second section 112 and of the third section 114. A by way of example and without limitation, each circular opening 150, 152 is arranged at the left end of the rear vertical wall 78 and front 80. These openings 150, 152 are provided for discharging water which would have formed by condensation on the second and third section. The water discharged through these circular openings 150, 152 is housed in the bottom of the housing, that is to say in the lower facade 22. The lower facade 22 is equipped at each of its four opening angles allowing water to drain out of the housing. According to FIG. 6, the heat dissipation device 44 is presented turned over so as to visualize the lower face 76 of the plate 50. There are the lower face of the first section 94, the second section 112 and the third section 114 According to the representation, the underside of the first section 94 is slightly raised relative to the flat surfaces of the second and of the third section. The lower surface of the first section 94 forms the rectangular protuberance 100 on the lower face of the plate 76. The underside of the second 112 and the third 114 section are generally aligned in the same horizontal plane. According to FIG. 6 and FIG. 7, the lower face of the plate 76 is adapted to receive the second printed circuit card 48. The lower face of the plate 76 is equipped with several fixing pads 154, 155 for the second printed circuit card 48. The fixing pads 154, 155 provided for the second printed circuit board 48 are oriented vertically downward and allow the second printed circuit board 48 to be held flat, in a horizontal plane. All the fixing pads 154, 155 are of hollow cylindrical shape, the hollow being a thread. The second printed circuit card 48 is therefore designed to be supported by screwing against the protruding underside of the first section of the plate 94. Overall, it will be noted in particular that four fixing pads 154 are generally provided to maintain the second printed circuit card 48 near these four angles. Another fixing stud 155 of the second printed circuit card 48 is arranged on the protruding underside of the first section 94, so as to improve the support of the heat generating zones 130, 132 (FIG. 5) of the second card with printed circuit 48 on the first section 94. In order to serve as a heat dissipation device 44, the underside of the first section 94 has planar cooling surfaces 156 which are generally rectangular and slightly raised relative to the surface of the first section 94 so as to form protuberances on the face bottom of the first section 94. These flat cooling surfaces 156 allow the heat generating zones 130, 132 of the second printed circuit board 48 to come to bear on the heat dissipation device 44. Preferably, the heat generating zones 130, 132 are located on the top face of the second printed circuit board 48 and are directly in contact by pressing on the flat cooling surfaces 156. However, it is also possible to cool heat generating zones of the underside of the second printed circuit board 48 when these are indirectly supported on the flat cooling surfaces 156; that is, separated from the flat cooling surfaces 156 by the thickness of the printed circuit board. According to the embodiment shown, the heat dissipation device 44 is made of a single metal piece. In other words, the plate 50, the first section 94, the second section 112, the third section 114, the plurality of fins 102, the fan support 84, the vertical fixing pillars 52, 54, 56, 58 of the heat dissipation device 44 on the bottom of the housing 22, the solid studs 136, the fixing studs 135, 136, 154, 155, the cooling surfaces 156, the flat cooling zone 138 are made in one piece metallic. Only the electrical connection elements 140, the screws and the printed circuit boards 46, 48 fitted with their electronic components and connectors are additional parts added to the heat dissipation device 44. The underside of the plate 76 has six electrical connection elements 140 allowing the contact, by crushing of their flexible end, of a metal body connector 148 of the second printed circuit board 48 to the heat dissipation device 44 thus than in the housing 12 of the multimedia control unit 10. These six electrical connection elements 140 are identical and have the same function as that described and mounted on the upper face of the plate 74. More generally, the electrical connection elements 140 can also be used to bring a conductive element of the first printed circuit board 46 or the second printed circuit card 48 into contact with the plate 50 and with the housing 12 so protect the conductive element against thermal overheating and against electromagnetic interference. An electrical ground copper track can be a conductive element of printed circuit boards, as can also metallic bodies of components 148. According to Figures 3, 5 and 7, a method of assembling the multimedia control module 10 can include several steps. A first step consists in having two printed circuit boards 46, 48 comprising heat generating zones 124, 126, 128, 130, 132. A second step consists in having a heat dissipation device 44 as described above through FIGS. 4 and 6. A third step consists in having a box 12 comprising a bottom of the box 22 and a front panel 20. A fourth step consists in fixing the first printed circuit board 46 on the upper face of the plate 74 in order to bring the heat generating zones 124, 126, 128 of the first printed circuit board 46 into contact with the upper face of the plate 74. A fifth step consists in fixing the second printed circuit card 48 on the lower face of the tray 76 in order to bring the heat-generating zones 130, 132 of the second printed circuit board 48 into contact on the underside of the tray 76. A sixth step involves nsiste to fix the fixing pillars 52, 54, 56, 58 of the heat dissipation device 44 equipped with the two printed circuit boards 46, 48 on the bottom of the housing 22. Other assembly steps can improve the heat dissipation and the electromagnetic interference protection of the multimedia control unit 10. An additional step can consist in arranging electrical connection elements 140 comprising flexible ends 142, 144 on the tray. 50 so as to bring the conductive elements 148 of the printed circuit boards 46, 48 into contact, by compression of the flexible ends, with the plate 50 and with the housing 12. Another step may consist in fixing the assembly of the plate 50 with printed circuit boards 46, 48 on one of the facades of the housing 14, 16, 18, 20. Another step may consist in providing a housing 12, two facades of which include openings 32, 34 allowing the flow of a flow of air in the multimedia control unit 10. A step may consist in assembling a fan 36 opposite a facade 16 comprising the openings ertures 34 in order to facilitate the circulation of an air flow in the multimedia control unit 10.
权利要求:
Claims (20) [1" id="c-fr-0001] 1. A heat dissipation device (44) comprising: a generally rectangular metallic cooling plate (50); the metal plate (50) comprising on its upper face (74) first fixing means (134, 135) of a first printed circuit board (46) provided to support at least one heat generating zone (124) the first printed circuit board (46) on the upper face (74) of the plate (50); characterized in that the metal plate (50) comprises on its lower face (76) second means for fixing (154, 155) of a second printed circuit board (48) designed to support at least one generating region of heat (130) from the second printed circuit board (48) on the underside (76) of the plate (50). [2" id="c-fr-0002] 2. A heat dissipation device (44) according to claim 1 characterized in that the upper face (74) of the plate (50) comprises a first section (94) equipped with a plurality of vertical cooling fins (102) each extending in a longitudinal direction substantially parallel to one side of the plate (50); the first section (94) comprising a part of the first fixing means (135) so as to allow the support of a heat-generating zone (124) of the first printed circuit board (46) on cooling fins ( 102). [3" id="c-fr-0003] 3. Heat dissipation device (44) according to claim 2, characterized in that the first section (94) comprises a flat cooling zone (138) extending transversely on the top of at least two fins (102) so as to allow the support of a heat generating zone (124) of the first printed circuit board (46) on the flat cooling zone (138). [4" id="c-fr-0004] 4. Heat dissipation device (44) according to any one of claims 2 to 3 characterized in that the first section (94) comprises at least one vertical solid cylindrical stud (136) overmolded in a cooling fin (102) so as to allow the support of a heat generating zone (124) of the first printed circuit board (46) on the free end of the solid cylindrical stud (136). [5" id="c-fr-0005] 5. A heat dissipation device (44) according to any one of claims 2 to 4 characterized in that the first section (94) forms a rectangular recess in the upper face (74) of the plate (50), forming a protuberance (100) rectangular on the underside (76) of the plate (50). [6" id="c-fr-0006] 6. heat dissipation device (44) according to any one of claims 2 to 5 characterized in that the underside of the first section (96) comprises a portion of the second fixing means (155) so as to allow the pressing at least one heat generating zone (130) of the second printed circuit card (48) on the underside of the first section (94). [7" id="c-fr-0007] 7. heat dissipation device (44) according to any one of claims 2 to 6 characterized in that the underside of the first section (94) comprises at least one planar cooling surface (156) forming a protuberance on the said underside, so as to allow the support of a heat generating zone (130) of the second printed circuit board (48) on the flat cooling surface (156). [8" id="c-fr-0008] 8. Heat dissipation device (44) according to any one of the preceding claims, characterized in that the plate (50) comprises at least three metal pillars (52, 54, 56) extending vertically downwards from the face lower (76) of the plate (50); the lower end of each pillar (52, 54, 56) is provided with a fixing means (60, 62, 64, 66) intended to be fixed on a housing bottom (22) so as to hold the plate ( 50) raised to arrange the second printed circuit board (48) on the underside (76) of the plate (50). [9" id="c-fr-0009] 9. Heat dissipation device (44) according to any one of the preceding claims, characterized in that a transverse side of the plate (50) comprises a fan support (84) capable of receiving a fan (36) making it possible to create a flow of cooling air from the plate (50) in a longitudinal direction. [10" id="c-fr-0010] 10. Heat dissipation device (44) according to claim 9 characterized in that the plate (50) comprises deflectors (106, 108) arranged between the fan support (84) and the first section (94) capable of guiding the cooling air flow. [11" id="c-fr-0011] 11. Heat dissipation device (44) according to any one of claims 9 to 10, characterized in that the plate (50) has an opening (110) between the first section (94) and the fan support (84 ), so as to promote an air flow on the two faces (74, 76) of the plate (50). [12" id="c-fr-0012] 12. Heat dissipation device (44) according to any one of the preceding claims, characterized in that the plate (50) comprises an electrical connection element (140) comprising two flexible contact ends (142, 144); the first end (142) being provided for establishing an electrical contact by compression between the cooling plate (50) and an electrically conductive element (148) of the first printed circuit board (46) or of the second printed circuit board ( 48); the second end (144) being provided for establishing an electrical contact by compression between the plate (50) and a metal case (12) enclosing the heat dissipation device (44); so as to thermally and electromagnetically protect the electrically conductive element (148). [13" id="c-fr-0013] 13. Heat dissipation device (44) according to claim 12 characterized in that the electrical connection element (140) comprises an intermediate part (146) by which the connection element (140) is fixed on the plate ( 50), the intermediate part (146) being extended on one side by the first flexible end (142) mainly in a direction perpendicular to the plate (50), and on the other side by the second flexible end (144) mainly a coplanar direction to the plate (50). [14" id="c-fr-0014] 14. Heat dissipation device (44) according to any one of claims 1 to 11 characterized in that the heat dissipation device (44) is made of a single metal piece. [15" id="c-fr-0015] 15. Electronic assembly characterized in that it comprises: a heat dissipation device (44) according to any one of the preceding claims; a first printed circuit board (46) comprising a heat generating zone (124) bearing on the upper face (74) of the cooling plate (50); a second printed circuit board (48) comprising a heat generating zone (130) bearing on the underside (76) of the cooling plate (50). [16" id="c-fr-0016] 16. Electronic assembly according to claim 15 and claim 8 characterized in that it comprises: a closed metal housing (12) of generally rectangular parallelepiped shape; the heat dissipation device (44) being fixed in the bottom of the housing (22). [17" id="c-fr-0017] 17. Electronic assembly according to claim 16 characterized in that the housing (12) comprises: a first group of openings (32) arranged on a first lateral face (14) of the housing (12) and facing the cooling plate (50); a second group of openings (34) arranged on a second lateral face (16) of the housing (12) opposite the first face (14) and facing the cooling plate (50); so as to allow the circulation of a cooling air flow 5 from the first group of openings (32) to the second group of openings (34). [18" id="c-fr-0018] 18. Electronic assembly according to claim 17 and claim 9 characterized in that a fan (36) is mounted in the fan support 10 (84) and is arranged in the housing (12) opposite one of the two opening groups (32, 34) so as to facilitate the circulation of the cooling air flow. [19" id="c-fr-0019] 19. Electronic assembly according to any one of claims 16 to 15 18 and any one of claims 12 to 13 characterized in that the plate (50) comprises an electrical connection element (140); at least one of the printed circuit boards (46, 48) includes a conductive element (148); the conductive element (148) being in electrical contact by the element of [20" id="c-fr-0020] 20 electrical connection (140) with the plate (50) and the metal case (12) so as to thermally and electromagnetically protect the conductive element (148). 1/6
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同族专利:
公开号 | 公开日 WO2018108702A3|2018-08-23| FR3060202B1|2019-07-05| EP3551501A2|2019-10-16| US10842045B2|2020-11-17| WO2018108702A2|2018-06-21| CN110062719A|2019-07-26| US20190335621A1|2019-10-31|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 EP1885169A1|2005-05-24|2008-02-06|Kabushiki Kaisha Kenwood|Device for air-cooling electronic apparatus| US5343359A|1992-11-19|1994-08-30|Cray Research, Inc.|Apparatus for cooling daughter boards| US5689403A|1994-12-27|1997-11-18|Motorola, Inc.|Intercooled electronic device| US5621614A|1995-08-24|1997-04-15|Lucasey Manufacturing Company|Apparatus for mounting and enclosing an appliance| US6305463B1|1996-02-22|2001-10-23|Silicon Graphics, Inc.|Air or liquid cooled computer module cold plate| US5986887A|1998-10-28|1999-11-16|Unisys Corporation|Stacked circuit board assembly adapted for heat dissipation| US6151215A|1998-12-08|2000-11-21|Alliedsignal Inc.|Single mount and cooling for two two-sided printed circuit boards| JP3852253B2|1999-10-21|2006-11-29|富士通株式会社|Electronic component cooling device and electronic equipment| US6707675B1|2002-12-18|2004-03-16|Hewlett-Packard Development Company, L.P.|EMI containment device and method| TW571613B|2003-04-29|2004-01-11|Quanta Comp Inc|Functional module built-in with heat dissipation fin| TW573458B|2003-06-09|2004-01-21|Quanta Comp Inc|Functional module having built-in heat dissipation fins| KR20050008258A|2003-07-15|2005-01-21|엘지이노텍 주식회사|Tuner| US7111674B2|2003-08-06|2006-09-26|Fujitsu Limited|Heat dissipating housing with interlocking chamfers and ESD resistance| US7061126B2|2003-10-07|2006-06-13|Hewlett-Packard Development Company, L.P.|Circuit board assembly| US20050134526A1|2003-12-23|2005-06-23|Patrick Willem|Configurable tiled emissive display| US7265985B2|2004-12-29|2007-09-04|Motorola, Inc.|Heat sink and component support assembly| US7298622B2|2005-06-15|2007-11-20|Tyco Electronics Corporation|Modular heat sink assembly| TWI326578B|2005-10-20|2010-06-21|Asustek Comp Inc|Pcb with heat sink by through holes| CN201274630Y|2008-10-13|2009-07-15|芯发威达电子有限公司|Heat radiation device| US7773378B2|2008-10-21|2010-08-10|Moxa, Inc.|Heat-dissipating structure for expansion board architecture| EP2292472A1|2009-09-04|2011-03-09|Delphi Technologies, Inc.|Closed and internal cooling system for car radio| JP5668506B2|2011-02-03|2015-02-12|三菱マテリアル株式会社|Power module substrate manufacturing method and power module substrate| TWI426214B|2011-03-15|2014-02-11|Sunonwealth Electr Mach Ind Co|Lamp| US8971041B2|2012-03-29|2015-03-03|Lear Corporation|Coldplate for use with an inverter in an electric vehicle or a hybrid-electric vehicle | JP5725050B2|2013-01-29|2015-05-27|トヨタ自動車株式会社|Semiconductor module| CN104470321B|2013-09-25|2017-11-17|泰科电子有限公司|Connector and connector combination for plug| WO2016041145A1|2014-09-16|2016-03-24|深圳市大疆创新科技有限公司|Heat dissipation apparatus and uav using heat dissipation apparatus| CN105699946B|2016-03-23|2017-10-20|西安电子工程研究所|A kind of multi-layer sealed cabinet with multiple hollow taper heat dissipation wind channels| TWI686549B|2018-11-23|2020-03-01|緯穎科技服務股份有限公司|Adjustable fixing device for a heat dissipating component and related electronic apparatus|JP2019149404A|2018-02-26|2019-09-05|トヨタ自動車株式会社|Heat radiation fin structure and cooling structure of electronic substrate using the same| CN112602036A|2019-07-12|2021-04-02|华为技术有限公司|Vehicle-mounted computing device in intelligent automobile and intelligent automobile| CN211630547U|2020-04-22|2020-10-02|苏州车邦智能科技有限公司|Automobile ECU controller|
法律状态:
2018-02-27| PLFP| Fee payment|Year of fee payment: 2 | 2018-06-15| PLSC| Publication of the preliminary search report|Effective date: 20180615 | 2019-12-26| PLFP| Fee payment|Year of fee payment: 4 | 2020-12-14| PLFP| Fee payment|Year of fee payment: 5 | 2021-12-09| PLFP| Fee payment|Year of fee payment: 6 |
优先权:
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申请号 | 申请日 | 专利标题 FR1662311|2016-12-12| FR1662311A|FR3060202B1|2016-12-12|2016-12-12|DEVICE FOR DISSIPATING HEAT FROM A MULTIMEDIA CONTROL UNIT|FR1662311A| FR3060202B1|2016-12-12|2016-12-12|DEVICE FOR DISSIPATING HEAT FROM A MULTIMEDIA CONTROL UNIT| PCT/EP2017/081882| WO2018108702A2|2016-12-12|2017-12-07|Heat dissipation device for a multimedia control unit| US16/466,471| US10842045B2|2016-12-12|2017-12-07|Heat dissipation device for a multimedia control unit| CN201780076413.XA| CN110062719A|2016-12-12|2017-12-07|The radiator of multipoint control unit| EP17825140.1A| EP3551501A2|2016-12-12|2017-12-07|Heat dissipation device for a multimedia control unit| 相关专利
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